All Entries Tagged With: "robot"
Electroactive Polymer Artificial Muscle (EPAM) Spring Roll Actuator
Electroactive Polymer Artificial Muscle (EPAM) Spring Roll Actuator developed by SRI International. Learn more at Hizook.com — http://www.hizook.com/blog/2009/12/28/electroactive-polymers-eap-artificial-muscles-epam-robot-applications Duration : 0:0:24
MEMS Robot from the University of Warterloo
A University of Waterloo engineering research team has developed the world’s first flying microrobot capable of manipulating objects for microscale applications. http://newsrelease.uwaterloo.ca/news.php?id=5055 Duration : 0:0:11
Nano Technology
Hope you know what you’re fighting against. My Personal Website – moorishbrooklynintelligence.blogspot.com For Conscious Books And More – astore.amazon.com For Conscious Apparel And More – www.cafepress.com Moorish Wall Street – www.myspace.com Duration : 0:2:17
Swiss Microrobot Playing “Pac Man” I
A gold/nickel microrobot of 300x300x70 micrometer (10^-6 m) dashing through a maze of photoresist walls. The robot is controlled by visual servoing, ie the user clicks a spot and the computer steers it there. The robot and required system was built by a team of researches at ETH Zurich (Swiss Federal Institute of Technology) and [...]
Robot design 08 at MTRN@UNSW (HQ)
Each group of 3-5 students needs to design an intelligent robot… Duration : 0:3:40
Micro swimming robot traveling through viscous fluid
The goal of this project (which is done by Dr. Bahareh Behkam et. al. in NanoRobotics lab at Carnegie Mellon University) is to develop a microrobot which can travel to currently inaccessible parts of the human body and perform user directed tasks such as highly localized drug delivery and screening for diseases that are in [...]
Robot Testing… SND IR Automtic conducting test
Bonding, Sealing, Gasketing, Painting, Lubrication, Surface Mount Adhesive, Solder Paste, Selective Flux Jetting, Conductive Adhesives, Solder Mask, Underfill, BGA Solder Ball Reinforcement, Dam & Fill, Chip Encapsulation, Chip Scale Package, Cavity Fill, Die Attach, Lid Seal, No Flow Underfill, Flux Jetting, Thermal Compounds, Radio Frequency Identification (RFID), LEDs, Lab-On-Chip Dispensing, Medical Electronics, Medical Device Assembly, [...]