Vision-based Microassembly of 3D Solid and Complex MEMS
admin | May 06, 2010 | Comments 0
The video shows an automatic assembly of fives silicon microparts of 400 µm x 400 µm x 100 µm on 3-levels. Each microassembly subtask is performed using a pose-based visual control which uses a CAD model-based tracker. The assembly clearance is estimated to 3 µm that allows to obtain solid and complex micro electromechanical structures without any external joining (glue, wending). For more informations, please go to http://www.femto-st.fr/
Duration : 0:1:12
Filed Under: MEMS
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